Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

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Customization: Available
Function: High Efficiency
Condition: New
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  • Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
  • Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
  • Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
  • Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
  • Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
  • Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
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  • Overview
  • Product Description
  • Product Parameters
  • Company Profile
  • Certifications
  • Our Advantages
  • After Sales Service
  • Exhibition
  • FAQ
Overview

Basic Info.

Model NO.
PAU1115-053
Certification
RoHS, ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Ground
Driven Type
Electric
Machine Weight
2000 Kg
Size of Burn-in Board (Bib)
450*570 mm
Tray Model
Jedec
Operating System
Windows 10
Suitable for
Various Chips
Transport Package
Wooden Box
Specification
2700*1750*1800mm
Trademark
PENGCHENG
Origin
China
HS Code
9030820000
Production Capacity
100 Units/Month

Product Description

Product Description

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automation, enabling fast connection between the front-end and back-end of chip burn-in. It avoids the issue of randomly placing chips into the BURN IN BOARD (BIB) due to vibration during manual handling. The main function of the Automatic Chip Sorting Machine is to automatically transfer ICs from the tray to the BIB, and vice versa. It can also classify and sort defective chips generated during burn-in based on the test results, placing them into the corresponding tray.
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

 

Product Parameters

Demension(L×W×H) 2700×1750×1800mm
Weight(with the elevator) Approximately 2000kg
Power supply AC220V 50Hz 5.5kW
Gas source 0.4MPa-0.7MPa
Gas consumption Approximately 330L/min
Operating mode Automatic operating mode / Manual operating mode
Operating system Windows 10(64 bit)
Industrial computer CPU:I7-6700
RAM:16G
Monitor:17 inches
Hard drive:128G SSD+1T Mechanical hard drive
Types of test chips PLCC,SOP,SSOP,BGA
Size of Burn-In Board (BIB) 450mm x 570mm
Tray model JEDEC
Suction nozzle pitch Ypitch: 15.5mm ~ 29.5mm
Xpitch: 20mm~60mm
Sorting position tray Number of items that can be placed Horizontal or vertical stacking of 6 layers
Number of stackable layers 3 layers
Height of tray stacking in the loading area Horizontal or vertical stacking of trays at a height of 20cm (standard)
Height of tray stacking in the unloading area Horizontal or vertical stacking of trays at a height of 20cm (standard)
Material retrieval method Vacuum suction nozzle
Warranty period 1year
Operating environment Temperature:10ºc to 35ºc
Humidity:<80%
Read information on the BIB board Barcode scanner
Reading information of tray material QR code scanner

Company Profile

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-ICPau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

Certifications

 

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

 

Our Advantages

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
We have a 5000 square meter machine debugging workshop, which is used for debugging, testing, maintenance, and troubleshooting of various models of machines.
We have a 1000 square meter manufacturing workshop for large-scale production of various machines and high-precision components.
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
We have a 600 square meter laboratory, which is used for the research and development, testing, and optimization of various machines and related technologies.

 

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC
 

After Sales Service

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

Exhibition

Pau1115-053 OEM ISO Approved High Efficiency Precision Chip Sorting Machine Equipment Semiconductor Chips Chip-Sop/Plcc/DIP/BGA-IC

FAQ

Q: What we can do for you?
A: We are committed to providing you with advanced equipment, technical solutions, and comprehensive service support to help you improve production efficiency, reduce costs, and optimize product quality.
Q: Are you a trade company or manufacturer?
A: We are a manufacturer with independent research and development capabilities and manufacturing capabilities, but we also provide OEM and ODM services.
Q: What is your delivery date?
A: About 35 days after receipt of payment.
Q: What is your payment terms?
A: 30% deposit in advance and 70% balance before shipment.
Q: What your main customers?
A: KAIFA,HUAWEI,SAMSUNG,HIKVISION,IBM,DJI,EPSON,CETC,ZTE...
Q: Why choose you?
A: As a state-owned enterprise, we enjoy solid guarantees in terms of funding, technology, and talent. Our business is stable and able to provide customers with stable and reliable products and services in the long term. At the same time, we have excellent research and production capabilities, and are able to customize personalized technology solutions.

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